Product introduction:

Through high-precision cutting, grinding, polishing and other cold processing processes of special materials, the surface roughness ≤1nm, TTV≤5µm and other surface requirements are met

Technical features and advantages:

The whole process of cold processing: products of different sizes of 4, 6, 8, and 12 inches can be provided

Product application:

Semiconductor substrate, semiconductor packaging, semiconductor bearing and other high-precision fields