SMD-Developed in 2009 and successfully mass-produced
Infrared cut-off filter-successfully developed and mass produced in 2016
Glass-ceramic mobile phone panel-successfully developed and mass produced in 2018
Wafers, silicon wafers and other products-successfully developed and mass produced in 2020
Successfully realized the automated transformation of automated polishing machines, automated engraving machines and other equipment and applied for national patents.

| Outer diameter size | 1.6mm×1.1mm、5mm×2.5mm |
| Frequency tolerance | 150kHZ |
| Minimum thickness | 0.022mm |
| Frequency | 212.5M——48M |
| Fundamental frequency | 74.45M——16M |
| *Remarks: | Can be customized according to customer needs |
Processing equipment | Inspection equipment | ||
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| Outer diameter size | 77mm×77mm |
| Outer diameter tolerance | ±0.05mm |
| Thickness size | 0.11mm、0.21mm、0.3mm |
| Appearance quality | 20/10 |
| Minimum thickness | 0.08mm |
| TTV | <3μm |
| *Remarks: | Can be customized according to customer needs |
Processing equipment | Inspection equipment | ||
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| Outer diameter size | 20——300mm |
| Outer diameter tolerance | ±0.05mm |
| Thickness size | 0.3mm——0.5mm |
| TTV | <3μm |
| Monolithic parallelism | ≤0.02 |
| Appearance quality | 20/10 |
| Roughness | Ra<5nm |
| *Remarks: | Can be customized according to customer needs |
Processing equipment | Inspection equipment | ||
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